Offline/Online Dual-Mode Dispensing Machine HP-750D One-Click Switch from Prototyping to Production
Product Overview
The HP-750D is the first dispensing machine that truly adapts to your production journey, featuring revolutionary Offline/Online Dual Mode operation with one-click switching. In Offline mode (same-side in/out), it functions as a standalone unit perfect for prototyping, trial production, and small batches—ideal for R&D labs and process development. When production scales up, simply click to switch to Online mode (left-in right-out) and the HP-750D instantly becomes a fully integrated inline machine within your automated SMT line, communicating via SMEMA with upstream and downstream equipment. This unprecedented flexibility means a single machine serves your needs from product development through high-volume manufacturing, eliminating the capital expense of separate prototyping and production systems. Behind this versatility lies serious capability: five-axis motion (U/R rotary), ±0.02mm precision, 800mm/s speed, and H-N02 back-suction valve for drip-free dispensing. For growing manufacturers and R&D-driven companies, the HP-750D delivers the perfect balance of development flexibility and production capability.
- Offline/Online Dual Mode - One-click switching between standalone and integrated SMT line operation
- Five-Axis Motion System (X, Y, Z, U, R) for complex selective dispensing on high-density PCBs
- U and R Axes with servo motor + hollow rotating platform for precise dispensing at component pins and odd angles
- High-Precision Drive with ±0.02mm repeatability and 800mm/s maximum speed
- Eight-Axis Motion Control for full coordination of all axes
- Dual Stepper Motor Conveyor with automatic speed adjustment (0.5-3.5m/min)
- H-N02 Silicone Back-Suction Dispensing Valve to prevent material dripping and waste
- Software Interface Electric Amplitude Modulation for precise control of dispensing parameters
| Functional Configuration |
Technical Parameters |
Functional Configuration |
Technical Parameters |
| Equipment Model |
HP-750D |
Conveying Height |
910 ±20mm |
| Size |
L=1060mm, W=1300mm, H=1700mm |
Delivery Speed |
0.5-3.5m/min |
| Equipment Weight |
Approx. 800kg |
Transport Track |
Special hard aluminum alloy track + stainless steel with edge chain |
| Control Method |
Industrial control machine + eight-axis motion control card |
Amplitude Modulation Method |
Software interface electric amplitude modulation |
| Software Running |
HAIPAI Motion Control Software + Win10 System |
Amplitude Modulation Speed |
250mm/min |
| Programming Method |
Teaching/key and mouse |
PCB Edge Space |
≥ 5mm |
| Number of Spindles |
X, Y, Z, U, R five axes |
Transmission Motor |
Double stepper motor control, automatic speed adjustment |
| Spindle Drive Method |
Servo motor + ball screw module, maximum moving speed 600-800mm/second |
Communication Port |
Standard SMEMA connector |
| Dispensing Range |
X:450mm Y:450mm |
Width of Single Dispensing |
Needles can be selected |
| Valve Types |
1 silicone back-suction dispensing valve H-N02 |
Air Pressure |
0.4~0.6Mpa |
| U and R Axis Configuration |
Servo motor + hollow rotating platform drive rotation |
Equipment Power Supply |
AC220V 50HZ |
| Maximum Movement Speed |
600-800mm/second |
Total Power |
1.8 kilowatts |
| Maximum Component Height |
Up and down 110mm |
Standard Functions |
LED lighting |
| Spindle Repeat Accuracy |
± 0.02mm |
Standard Functions |
Automatic soaking and flushing function |
| Number of Tracks |
2, fixed side to the front |
Electrostatic Interface |
Standard
|
Industry Keywords Tag Cloud :
Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System
Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application
Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric
Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection
Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control
Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration
